HypoGel® 400 Diol

Product information

HypoGel® is a hydrophilic Gel® type resin which combines high capacities with good solvent compatibility. Glycol spacers with n = 5 or 10 EO units separate the reactive sites from the polystyrene matrix and modify the hydrophobic properties of the polystyrene backbone. Due to the spacer effect the functional group shows a higher mobility which results in higher kinetic rates and high resolution NMR spectra from immobilized compounds on the bead. The resin is compatible to a wide range of solvents and in contrast to polystyrene even polar solvents like methanol or ethanol can be used.
These resins show high loading and a hydrophilicity between polystyrene and TentaGel®An ideal support for aldehyde immobilization via acetal formation.
In this resin the glycol spacer contains 10 EO units which separate the reactive sites from the polystyrene matrix.


Literature

L 17 HypoGel®

  1. Rapp W., Recent Advances in Synthesis and Use of High Load Spacer-modified Supports in SPS in Innovation and Perspectives in Solid Phase Synthesis & Combinatorial Libraries, Collected Papers of the 7th International Symposium 2001 (Epton, R., Ed.); Mayflower Wordwide: Kingswinford, England, 2002, 9.

L 46 Diol Resins

  1. Leznoff, C. C.; Wong, J. Y. The Use of Polymer Supports in Organic Synthesis. III. Selective Chemical Reactions on One Aldehyde Group of Symmetrical Dialdehydes. Can. J. Chem. 1973, 51 (22), 3756-3764. doi: 10.1139/v73-561.
  2. Chamoin, S.; Houldsworth, S.; Kruse, C. G.; Iwema Bakker, W.; Snieckus, V. The Suzuki-Miyaura Cross Coupling Reactions on Solid Support. Link to Solution Phase Directed Ortho Metalation. The Leznoff Acetal Linker Approach to Biaryl and Heterobiaryl Aldehydes. Tetrahedron Lett. 1998, 39 (24), 4179-4182. doi: 10.1016/s0040-4039(98)00779-5.
  3. Maltais, R.; Bérubé, M.; Marion, O.; Labrecque, R.; Poirier, D. Efficient Coupling and Solid-Phase Synthesis of Steroidal Ketone Derivative Using Polymer-Bound Glycerol. Tetrahedron Lett. 2000, 41 (11), 1691-1694. doi: 10.1016/s0040-4039(00)00050-2.